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META (Metamaterial)

Gold

Meta Materials Inc. (META®)

Voltera

Gold

Voltera

Panasonic Electronic Materials

Silver

Panasonic Electronic Materials

Agfa

Silver

Agfa

BeLink Solutions

Silver

BeLink Solutions

Brewer Science

Silver

Brewer Science

Brilliant Matters

Silver

Brilliant Matters

Celanese MicroMax

Silver

Celanese MicroMax

Danish Technological Institute

Silver

Danish Technological Institute

DuPont  Teijin Films

Silver

DuPont Teijin Films

Electroninks Ltd

Silver

Electroninks Ltd

IDS Inc

Silver

IDS Inc

Neotech AMT GmbH

Silver

Neotech AMT GmbH

Panacol-Elosol GmbH

Silver

Panacol-Elosol GmbH

SmartKem

Silver

SmartKem

Tracxon

Silver

TracXon

XTPL

Silver

XTPL

ADVPES

Silver

Advanced Printed Electronic Solutions

Binder ITZ

Silver

binder ITZ

COATEMA Coating Machinery GmbH

Silver

COATEMA Coating Machinery GmbH

Copprium

Silver

Copprium

FUJI CORPORATION

Silver

FUJI CORPORATION

INKATRONIC

Silver

INKATRONIC

MacDermid Alpha

Silver

MacDermid Alpha

Metafas

Silver

Metafas

Molex

Silver

Molex

XTPL
XTPL
XTPL

Silver

Shaping Global Nanofuture

+48 71 707 22 04

About

XTPL is a company developing globally innovative, additive manufacturing technology that enables ultra-precise printing of nanomaterials. Unique XTPL printing system allows for precise deposition of an in-house ...

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Documents & Videos

Event Presentations

Lukas Kosior

Business Development Manager

Digital Direct Printing of Color Conversion Materials for MicroLEDs*
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Micro-LED & QD 2023

Łukasz Kosior

Business Development Manager

Solution for printed micro-electronics. Next generation of resolution in additive technology.
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Berlin 2023

Lukasz Kosior

Business Development Manager

Revolutionizing Microelectronics Applications with XTPL's Ultra-Precise Deposition Solution
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Innovations Festival 2023

Lukasz Kosior

Business Development Manager

Sub-micron digital printing for microLED microbumps and QD Color Conversion
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QDs & MicroLEDs 22

Lukasz Kosior

Business Development Manager

XTPL Ultraprecise Deposition Technology for Advanced Printed µElectronics Applications
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