Interconnect technologies for flexible hybrid stretchable electronics: from conductive adhesives to low-T solder
Interconnects are one of the most important technology elements in the entire flexible hybrid stretchable or soft electronics field. The requirements and limitations are fundamentally different to that of traditional SMTs and PCBs thus new solutions are required. Indeed, interconnect technologies can often hinder the performance of these systems.
In this class the participants will learn the following:
The existing and emerging requirement set from processing temperature, pitch, adhesion, flexibility and stretchability, reliability, method of application, etc
Overview of different types of conductive adhesives. Here you will learn the pros and cons of each solution, understanding how each solution can find use in a different application
Overview of existing and emerging low-temperature solder, understanding the processing requirements as well as the applicability of different solder solutions. The emphasis will be on emerging low temperature solders compatible with flexible low-temperature substrates
Discuss the key design considerations and challenges when implementing interconnect technologies in flexible and stretchable electronics, such as mechanical stability, electrical performance, and manufacturability.
Examine the current and emerging applications of flexible hybrid stretchable electronics and understand how advancements in interconnect technologies can propel their development and adoption across various industries.